Research Teams Combine Technologies to Produce Novel Power Module and Cooling System
Outcome/Accomplishment
Researchers integrated a large-footprint microchannel cooler and multi-chip silicon carbide (SiC) power module, combining two independent efforts to produce a single solution. The work was supported by the Center for Power Optimization of Electro-Thermal Systems (POETS), an NSF-funded Engineering Research Center (ERC) based at the University of Illinois.
Impact/Benefits
Simulations at Stanford University, a POETS partner, showed that the micro-cooler achieved a decrease of 25°C at the junction of the device compared with conventional thermal management. The achievement indicates that integration of the two advances can result in lower costs and better heat dissipation in tightly packaged electronics.
Explanation/Background
Led by a team at the University of Arkansas (another Center partner), POETS researchers had earlier fabricated the multi-chip SiC power module, which is designed to take advantage of SiC's better thermal characteristics. Another team led by Stanford researchers constructed a flow-loop system for high flow rates, up to 5-to-6 liters per minute. Software controls the system, with fail-safe modes that produce a robust and reliable system.
Combining the technologies into a single solution was made possible by the collaborative initiative at POETS.
Location
Urbana-Champaign, Illinoiswebsite
Start Year
Microelectronics and IT
Microelectronics, Sensing, and IT
Lead Institution
Core Partners
Fact Sheet
Outcome/Accomplishment
Researchers integrated a large-footprint microchannel cooler and multi-chip silicon carbide (SiC) power module, combining two independent efforts to produce a single solution. The work was supported by the Center for Power Optimization of Electro-Thermal Systems (POETS), an NSF-funded Engineering Research Center (ERC) based at the University of Illinois.
Location
Urbana-Champaign, Illinoiswebsite
Start Year
Microelectronics and IT
Microelectronics, Sensing, and IT
Lead Institution
Core Partners
Fact Sheet
Impact/benefits
Simulations at Stanford University, a POETS partner, showed that the micro-cooler achieved a decrease of 25°C at the junction of the device compared with conventional thermal management. The achievement indicates that integration of the two advances can result in lower costs and better heat dissipation in tightly packaged electronics.
Explanation/Background
Led by a team at the University of Arkansas (another Center partner), POETS researchers had earlier fabricated the multi-chip SiC power module, which is designed to take advantage of SiC's better thermal characteristics. Another team led by Stanford researchers constructed a flow-loop system for high flow rates, up to 5-to-6 liters per minute. Software controls the system, with fail-safe modes that produce a robust and reliable system.
Combining the technologies into a single solution was made possible by the collaborative initiative at POETS.