A Novel Power Module
Outcome/Accomplishment
To explore and validate advanced thermal management solutions, researchers at the U.S. National Science Foundation (NSF)-funded Center for Power Optimization of Electro-Thermal Systems (NSF POETS) conducted a wide range of power module projects. Among those successful research projects, the most impactful is the development of a 6-in-1 SiC power module featuring double-sided microchannel cooling.
Impact/Benefits
Thermal management is one of the primary constraints in achieving higher peak power capability in power modules. Efficient heat dissipation not only enables increased power density in power electronic systems but also enhances overall system reliability—one of the central missions of NSF POETS over the past 10 years.
Explanation/Background
The advanced 6-in-1 power module integrates high-performance microchannel coolers directly onto the DBC substrate right under the attached chips (fig a). This compact thermal layer design minimizes the chip-to-coolant thermal resistance to as low as 0.45 K/W per chip. For a typical SiC chip area of 31 mm², the module achieves a maximum power dissipation of 333 W and a maximum drain-source current of 126 A at a junction temperature of 175 °C. To further enhance performance, the module adopts a wire-bondless interconnection combined with a laminated power terminal structure. This reduces power loop inductance to below 2 nH, contributing to lower switching losses and supporting high switching frequencies. Additionally, Cu/Mo spacers are used not only to ensure electrical insulation and mechanical integrity but also to provide a secondary thermal dissipation path (fig. b).
Compared to traditional half-bridge power modules used in three-phase inverter systems, this 6- in-1 module greatly simplifies the system architecture. It reduces the number of paralleled power modules from 3 to 1, lowers the cooling solution volume by approximately 66%, and increases the overall power density of power inverter up to 185.1kW/L (fig. c).
Location
Urbana-Champaign, Illinoiswebsite
Start Year
Quantum, Microelectronics, Sensing, and IT
Lead Institution
Core Partners
Fact Sheet
Outcome/Accomplishment
To explore and validate advanced thermal management solutions, researchers at the U.S. National Science Foundation (NSF)-funded Center for Power Optimization of Electro-Thermal Systems (NSF POETS) conducted a wide range of power module projects. Among those successful research projects, the most impactful is the development of a 6-in-1 SiC power module featuring double-sided microchannel cooling.
Location
Urbana-Champaign, Illinoiswebsite
Start Year
Quantum, Microelectronics, Sensing, and IT
Lead Institution
Core Partners
Fact Sheet
Impact/benefits
Thermal management is one of the primary constraints in achieving higher peak power capability in power modules. Efficient heat dissipation not only enables increased power density in power electronic systems but also enhances overall system reliability—one of the central missions of NSF POETS over the past 10 years.
Explanation/Background
The advanced 6-in-1 power module integrates high-performance microchannel coolers directly onto the DBC substrate right under the attached chips (fig a). This compact thermal layer design minimizes the chip-to-coolant thermal resistance to as low as 0.45 K/W per chip. For a typical SiC chip area of 31 mm², the module achieves a maximum power dissipation of 333 W and a maximum drain-source current of 126 A at a junction temperature of 175 °C. To further enhance performance, the module adopts a wire-bondless interconnection combined with a laminated power terminal structure. This reduces power loop inductance to below 2 nH, contributing to lower switching losses and supporting high switching frequencies. Additionally, Cu/Mo spacers are used not only to ensure electrical insulation and mechanical integrity but also to provide a secondary thermal dissipation path (fig. b).
Compared to traditional half-bridge power modules used in three-phase inverter systems, this 6- in-1 module greatly simplifies the system architecture. It reduces the number of paralleled power modules from 3 to 1, lowers the cooling solution volume by approximately 66%, and increases the overall power density of power inverter up to 185.1kW/L (fig. c).